MALVERN, Pa.--(BUSINESS WIRE)--Vishay Intertechnology, Inc. (NYSE: VSH) today introduced two new leadless NTC thermistor dies — contacted on the top and bottom — that provide designers with the same mounting options as IGBT semiconductors. Featuring gold metallization, the Vishay BCcomponents NTCC300E4 supports gold wire bonding and conductive adhesive gluing, while the NTCC200E4 with silver metallization supports aluminum wire bonding and is compatible with reflow soldering and nano-silver pas