SINGAPORE--(BUSINESS WIRE)--Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") today announced they are joining A*STAR’s Institute of Microelectronics (IME)’s High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium, together with other major industry players. Through the collaboration, K&S is confident that with the combined experience and knowledge, the consortium will extend FOWLP capabilities for applications, such as tablets and s