ASE and TDK Announce Plans for a Joint Venture Agreement to Manufacture Embedded Substrates

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KAOHSIUNG, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) and TDK Corporation (TSE: 6762) announced today that both companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates using TDK’s SESUB® (Semiconductor Embedded SUBstrate) technology. ASE and TDK plan to own 51 percent and 49 percent, respectively, of the newly created entity. The indicative name of the joint venture company will be ASE Embe

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