TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO:6502) today unveiled the new generation of BiCS FLASH™, a three-dimensional (3D) stacked cell structure flash memory*1. The new device is the world’s first*2 256-gigabit (32gigabytes) 48-layer BiCS device and also deploys industry-leading 3-bit-per-cell (triple-level cell, TLC) technology. Sample shipments will start in September. BiCS FLASHTM is based on a leading-edge 48-layer stacking process that surpasses the capacity of mainstream two dim