DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/dqvmq4/450mmcopperlowk) has announced the addition of the "Global 450mm/Copper/Low-K Convergence 2014-2018: Updated Timing, Trends, Issues, Market Analysis" report to their offering.

450mm semiconductor silicon wafer transition has become a reality. Intel and TSMC have outlined plans to build 450mm fabs. Roadmaps call for 450mm pilot lines in 2015 and 2016, with high-volume production targeted for 2018.

The 450mm revolution has changed gear: from a 'debatable concept' to 'realistic plans'. Most of the efforts (and the money) will be invested in developing 450mm process tools, assuming that developing wafer metrology tools is the easy part as the measuring concept is not being changed.

This report discusses the technological and economic impact on the 450mm/Cu/Low-K convergence.

This report discusses the timing, trends, issues, and market analysis of 450mm wafers/tools, copper deposition/etch/CMP, and low-k materials.

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 300mm Wafer Issues and Trends

Chapter 4 Copper Issues and Trends

Chapter 5 Low-K Dielectric Issues and Trends

Chapter 6 Market Analysis

For more information visit http://www.researchandmarkets.com/research/dqvmq4/450mmcopperlowk