TOKYO--(BUSINESS WIRE)--TDK Corporation (President: Takehiro Kamigama) announces that it will participate in the ‘CEATEC JAPAN 2013’ exhibition from October 1st (Tue) to October 5th (Sat), 2013 at Makuhari Messe.

This year the message from our booth is: 'Magnetic materials are the core of TDK's next generation solutions'. Our demonstrations will focus on new products and technologies, categorized into anticipated future growth segments of 'energy-related markets', and 'next-generation telecommunications markets'. We encourage you to take this opportunity to drop by the TDK booth this year.

TDK booth overview, including major product and technological exhibits

[Booth Overview]

Following a presentation on the main stage presenting the highlights of this year's exhibit, which focuses on magnetic products, there will be an engineer-led product presentation of our key products.

• ‘Energy-related market areaOur Energy-related market area is comprised of a car-mounted product corner, and a smart-grid corner. On display will be a full-scale model car loaded with our products and technologies, in addition to exhibits of our power conditioning electronic components. In the car-mounted corner you will find our 'on-board vehicle DC-DC converter', which boasts twice the output power per unit volume compared to existing products while achieving the world's leading standard output of 2W/cc. Also on display will be an 'automotive contact-free power supply system', consisting of a power reception coil miniaturized to A4 paper size.The smart-grid corner showcases a high-efficiency 'isolated bi-directional DC-DC converter' that enables seamless step-up or step-down functionality with one converter.

• ‘Next-generation telecommunications market areaThe ‘Next-generation telecommunications market area is comprised of a data-center corner and a smartphone corner. This area features live demonstrations of solutions that contribute to the further evolution of next-gen telecommunications.An explosive increase of information volume has accompanied the growth of cloud computing. In the data-center corner you will find 'thermally assisted heads' for high density recording, which will make HDD high capacity storage achievable. The smartphone corner showcases compact, thin-film passive components, as well as the industry’s thinnest flexible and impact-resistant 'Qi standards-compliant contact-free power supply coil unit'.