DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/xltmg4/power_module) has announced the addition of the "Power Module Packaging Performance Is Now Essential In Meeting Market Needs" report to their offering. In order to increase power module yield and reliability, companies are working on new products for power packaging, especially for the common failure locations, die and substrate attach, interconnection and encapsulation. Both new designs and new mat