DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/8qxpm6/fanout_and) has announced the addition of the "Fan-Out and Embedded Die: Technologies & Market Trends" report to their offering. Today, the market is worth almost $200M and we anticipate 30% CAGR is in coming years Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow ran
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