MALVERN, Pa.--(BUSINESS WIRE)--Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has added a new sidewall patterning capability to its custom thin film substrate offering. This capability allows Vishay to provide conductive patterning on up to four surfaces with compact line width and gap dimensions, increasing design flexibility and density for miniaturization in military, aerospace, medical, and telecom equipment. Unlike traditional solutions with plated or filled vias, the Vis


| < Prev | Next > |
|---|






