PHILADELPHIA--(BUSINESS WIRE)--For the fourth time, Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), has received a New Product Introduction (NPI) Award from Printed Circuit Design and Fab (PCD&F) Magazine for its MICROFILL™ platform, this time with MICROFILL™ LVF 4 Acid Copper. As the Internet of Things advances, speedy and stable signal transmission across wireless networks is critical. Dow MICROFILL LVF 4 Acid Copper offers excellent microvia filling and
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