SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7. Samsung’s new CSP technology significantly scales down the size of an LED package, which enables more flexible and compact designs when manufacturing consumer LED lighting modules or fixtures, and lowe
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