LEIDEN, Netherlands--(BUSINESS WIRE)--IXYS Corporation (NASDAQ:IXYS), a leader in power semiconductors and IC technologies for energy efficient products used in power conversion and motor control applications, announced today the extension of the D2-Pak (TO-263) and D3-Pak (TO-268) packages without middle terminal for higher voltage solutions that require Surface Mount Devices (SMD) with enlarged creepage distances. “The new D2 and D3-Pak design without a middle pin provides creepage distances
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