SINGAPORE--(BUSINESS WIRE)--Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") introduces a new addition to the APAMATM Series of highly adaptive Thermo-Compression (TC) Bonders, the C2W (Chip-to-Wafer) bonder. The APAMA C2W is the second in the series to be launched, following the C2S (Chip-to-Substrate) bonder introduced in 2014. The APAMA series TC Bonders deliver industry-leading throughput, placement accuracy, metrology and cost-of-ownersh
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