GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of up to 200 mm. Key process parameters can be adjusted in a wide range, which makes the system ideal for advanced process development. In a production environment, the high level of aut
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